2014年国际无线会议（IWS）技术议程及研讨会预告

本次研讨会从中国移动的角度概述了5G无线发展中的技术与挑战。5G将提高10倍以上的网络传输能力，其消耗的能量却只占现有4G网络的一小部分。Section 1 对系统和架构问题以及可能的解决方案进行高水平深入的分析。Section 2 针对5G原型机的研制开发、实际的挑战和测量技术分析5G技术的实际应用。

主讲人与报告题目：

Introduction of 5G Cellular Challenges & Technologies with Workshop Overview: Corbett Rowell

Section 1: 系统级和理论工作
- Architectural and signaling design towards diverse traffic profiles: Li Gang (China Mobile)
- C-RAN Architecture: Huang Jin Ri (China Mobile)
- Spectral-Efficiency and Energy-Efficiency Co-Design: Xu Zhi Kun (China Mobile)
- Large Scale Antenna System & Full Duplex Analysis: Han Shuang Feng (China Mobile)

Section 2: 实际应用
- Section Overview & Large Scale Antenna System Prototype for 4G TD-LTE: Corbett Rowell
- Small Cell Capacity Enhancements: Eric Tsang (ASTRI) - 8. Measurement of Massive MIMO and Active Base-station: Lars Jacob Foged (Satimo)
- Workshop Summary

3、多层/3D 微波毫米波MCM/SoP：最新进展与挑战

由于更高频的诸多优势，微波和毫米波（MMW）不断引起商业和军事应用的兴趣。单片集成电路（MMIC/RFIC）技术提供了大量制作高可重复性、低成本的毫米波电路的途径。但是，高频时模块/电路组装技术更加复杂，成本更高。多层/3D集成技术，如多芯片模块（MCM）或者系统级封装（SoP），是以低成本实现更多产品功能和更大可重复性的极好的系统集成化技术，因而得到广泛的欢迎。过去的十年间，这些技术已经有了巨大的发展，但是也仍有许多挑战亟待解决。本次研讨会将进行广泛的展示，并将提供一个对多层先进的MCM/SoP技术（包括LTCC、LCP、可感光厚膜和BCB）的完整的概要和理解，以及它们现在的挑战，还将使参与者对最近的重要进展，包括MMICs与封装（SOC和SOP）的协同设计以及新兴的MCM/SoP应用的混合集成技术，增进一定的了解。主讲人是来自工业界和学术界的专家和主要贡献者。

主讲人与报告题目：

特邀报告：Kamal K. Samanta, title: “Ceramic Based Novel Multilayer and Miniaturized RF/Millimetre-Wave Components and Highly Integrated Mm-Wave Modules”

- "Co-Design of CMOS SOC/SOP for Commercial mmW Applications" Dr. Joy Laskar, IEEE Fellow, Partner Anayas360, USA

- “mmW Single-chip Radar and Its Packaging Concepts: Performance and Cost Perspective”. Dr.-Ing. Yaoming Sun Scientist IHP Microelectronics, Frankfurt, Germany

- “High Performance Multilayer MCM/SoP Components for Novel Microwave and Mm-wave Modules”. Dr. Kamal K Samanta, Senior Principal Engineer & Project Manager, Milmega/Teseq Ltd, Ryde, UK

- “Multilayer 3D LTCC and IPD integration platforms and components from RF to Millimeter Wave Applications” Dr. Tauno Vähä-Heikkilä, Principal Scientist, VTT Technical Research Centre of Finland, Finland

- “Inkjet-Printed Nanotechnology-enabled RFID, Internet of Things and “Zero-Power” Wireless Sensor Nodes”. Prof. Manos M. Tentzeris, IEEE Fellow and Distinguished Microwave Lecturer Georgia Tech, USA

4、基板合成波导组件与系统

基片集成波导技术越来越吸引了更多的学术界和工业界的关注，可以实现很大范围的组件和天线的多种应用。本次研讨会将展示新型电路技术、创新的材料和制造技术、前所未有的领域的新应用等方面的最新进展。来自亚洲、欧洲和美洲的著名的专家将介绍他们的最新研究进展，并与观众进行互动交流。

主讲人与报告题目：

- Ke Wu (Canada) Title: Extension and Expansion of Substrate Integrated Circuits into the Development of Next Generation Wireless Technologies

- Eric Rius (France) Title: High K ceramic for the size reduction of RF filters)

- Wen Wang, Robab Kazemi, Aly E. Fathy Title: Wide Band Feeds and Antennas Implemented using SIW Structures

- Wei Hong (China) Title: TBD

- Ziqiang Xu (China) Title: Substrate Integrated Waveguide Components Based on LTCC technology

- Maurizio Bozzi (Italy) Title: SIW Components based on Novel Materials for Wireless Sensor Networks and the Internet of Things

- Wenquan Che (China), Haidong Chen, Wenjie Feng, Y. L. Chow Title: The Current Researches and Next Trends of Substrate Integrated Waveguide