射频电路和射频集成电路设计中的关键课题（英文）

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本书着重论述和强调在射频电路和射频集成电路设计中的共同的关键性课题。内容包括：射频和射频集成电路设计的核心部份: 阻抗匹配；基本射频参数和方程式；射频接地；从单端线路到差分线路；容许误差分析；射频集成电路设计中的难题；低噪声放大器设计的讨论。
本书的读者对象是大学的高年级学生、研究生和工程技术人员。
My motivation to write this book
Today, many books about RF (Radio Frequency) circuit design are available for students, researchers, and designers. In these books, the operating principles and circuit topologies are well explained and presented. In addition to offer training of the use of simulation tools, they enable a student who has just graduated from university to start RF circuit designing in his/her new job.

Chapter 1 Importance of Impedance Matching
　1.1 Difference between RF and Digital Circuit Design
　　1.1.1 Case 1: Digital Circuits at Low Data Rate
　　1.1.2 Case 2: Digital Circuits at High Data Rate
　1.2 Significance of Impedance Matching
　　1.2.1 Power Transportation from a Source to a Load
　　1.2.2 Maximizing of Power Transportation without Phase Shift
　　1.2.3 Conjugate Impedance Matching and Voltage Reflection Coefficient
　　1.2.4 Impedance Matching Networ
　1.3 Problems due to Unmatched Status of Impedance
　　1.3.1 General Expression of Power Transportation
　　1.3.2 Power Instability and Additional Power Los
　　1.3.3 Additional Distortion and Quasi-Noise
　　1.3.4 Power Measurement
　　1.3.5 Power Transportation and Voltage Transportatio
　　1.3.6 Burning of a Transistor
　References
Chapter 2 Impedance Matching
　2.1 Impedance Measured by Small Signal
　　2.1.1 Impedance Measured by S Parameter Measurement
　　2.1.2 The Smith Chart: Impedance and Admittance Coordinatio
　　2.1.3 Accuracy of Smith Chartl
　　2.1.4 Relationship between the Impedance in Series and in Parallel
　2.2 Impedance Measured by Large Signal
　　2.3 Impedance Matching
　　2.3.1 One Part Matching Network
　　2.3.2 Recognition of Regions in a Smith Chart
　　2.3.3 Two Parts Matching Network
　　2.3.4 Two Parts Upward and Downward Impedance Transformer
　　2.3.5 Three Parts Matching Network and Impedance Transformer
　　　2.3.5.1 Topology Limitation of Two Parts Matching Network
　　　2.3.5.2 Π Type Matching Network
　　　2.3.5.3 T Type Matching Network
　2.4 Some Useful Schemes for Impedance Matching
　　2.4.1 Designs and Tests when ZL is not 50 Ω
　　2.4.2 Conversion between“T” and “Π” Type Matching Network
　　2.4.3 Parts in a Matching Network
　　2.4.4 Impedance Matching between Power Transportation Units
　　2.4.5 Impedance Matching for a Mixer
　References
Chapter 3RF Grounding
　3.1 A True Story
　3.2 Three Components for RF Grounding
　　3.2.1 “Zero” Capacitors
　　3.2.2 Micro Strip Line
　　3.2.3 RF Cable
　3.3 Examples of RF grounding
　　3.3.1 Test PCB
　　　3.3.1.1 Small Test PCB
　　　3.3.1.1.1 Basic Types of Test PCB
　　　3.3.1.1.2 RF Grounding with a Rectngular Metallic Frame
　　　3.3.1.1.3 An Example
　　　3.3.1.2 Large Test PCB
　　　3.3.1.2.1 RF Grounding by “Zero” Chip Capacitors
　　　3.3.1.2.2 RF Grounding by a Runner or a Cable with Half or Quarter Wavelength
　　3.3.2 Isolation between Input and Output in a Mixer or an Up-converter
　　3.3.3 Calibration for Network Analyzer
　3.4 RF Grounding for Reduction of Return Current Coupling
　　3.4.1 A Circuit Built by Discrete Parts on a PCB
　　3.4.2 RFICs
　References
Chapter 4 Equivalent Circuits of Passive Chip Parts
　4.1 Modeling of Passive Chip Parts
　4.2 Characterizing of Passive Chip Parts by Network Analyzer
　4.3 Extraction from the Measurement by Network Analyzer
　　4.3.1 Chip Capacitor
　　4.3.2 Chip Inductor
　　4.3.3 Chip Resistor
　4.4 Summary
　References
Chapter 5 Single-ended Stage and Differential Pair
Chapter 6 Balun217
Chapter 7 Tolerance Analysis239
Chapter 8 Prospect of RFIC Design269
Chapter 9 Noise, Gain, and Sensitivity of a Receiver317
Chapter 10 Non-linearity and Spurious Products339
Chapter 11 Cascaded Equations and System Analysis 358
Chapter 12 From Analog to Digital Communication System376