2018 Joint IEEE EMC & APEMC 大会

The 2018 Joint IEEE International Symposium on Electromagnetic Compatibility & Asia-Pacific Symposium on Electromagnetic Compatibility (2018 Joint IEEE EMC & APEMC) will take place at the Suntec Convention and Exhibition Center in Singapore from 14 to 17 May 2018.

The joint symposium combines the 60th IEEE International Symposium on EMC with the 9th APEMC Symposium. For the former, it is only the 4th time for it to be held outside the North America Continent in 60 years and the first time in Asia over the past three decades. For the latter, it is a homecoming to where the APEMC originated 10 years ago.

The symposium Technical Program Committee invites you to submit your original and unpublished papers and/or abstracts in all aspects of electromagnetic compatibility (EMC) as well as signal and power Integrity (SI/PI), including but not limited to EMC/SI/PI design, modeling, management, measurements, and education. All eligible papers will be published online at the IEEE Xplore, as conference proceedings, in a special issue of IEEE Transactions on Electromagnetic Compatibility and IEEE EMC Magazine.

Plan ahead and join this unique symposium, meet international colleagues, present your latest research findings, share your insight and perspectives, ask questions, learn from experts and innovators, explore collaborations, visit exhibitions and see new products. Experience Singapore, where east meets west, and much more!

2018 Joint IEEE EMC & APEMC 大会有一个专题会议Topical Symposium on Smart Grid & Power Electronics EMC，诚挚邀请各位电磁兼容同行投稿参会。

投稿系统目前已开放，截稿日期是12月23日，还有两个多月时间，大家可以充分准备。建议原来没参加过APEMC会议的同行，争取参加，因为这个会议与IEEE EMC联合举办，有望聚集全世界最顶尖的EMC专家参会。

这个会议是2018年5月14至17日在新加坡举办，请各位EMC同行知悉。